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IEEE International 3D System Integration Conference 2011 (3DIC 2011)

Sponsors
Association of Super-Advanced Electronics Technologies (ASET)
IEEE CPMT Society
Fraunhofer EMFT
IMEC
Tohoku University
North Carolina State University
ITRI（Industrial Technology Research Institute）
IME（Institute of Microelectronics）
Supports
NEDO（New Energy and Industrial Technology Development Organization）
Conference Date
January 31（Tue）-Februaly 2（Thu）,2012
Conference Venue
Senri Life-Science Center（http://www.senrilc.co.jp/）
1-4-2 Shinsenri higashi-machi Toyonaka-City Osaka 560-0082 Japan
A few-minutes walk from Subway Station, Senri-Chuo
5 minutes walk from Monorail Station, Senri-Chuo
Registration Fee

\45,000
Student
\20,000
Information on 3DIC
Contact
3DIC 2011 Secretariat
C/O Inter Group Corp.
Akasaka-sanno Square Bldg. 2-2-12 Akasaka Minato-ku, Tokyo 107-0052, Japan
E-mail：info-3dic2011@intergroup.co.jp

ASET（Association of Super-Advanced Electronics Technologies）
Tokyo Dia Bldg.（No.1 8F）　1-28-38, Shinkawa, Chuo-ku, Tokyo 104-0033, Japan
E-mail：kada@aset.tokyoinfo.or.jp