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Lithography
Technology |
Material,Process,
Equip.
Technologies |
Test, Assembly,
3D Integration
Technologies |
Magnetic Disk
Technologies |
LCD
Technologies |
System, Software
Technologies |
 Super-Advanced Electronics Technologies
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Electron Beam Direct Writing System (FY1995-1998) |
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Development of single-column and multi-column EB direct writing systems for higher throughput and accuracy. |
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Super High Precision Mask Fabrication System (FY1995-1998)
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Development of two EB mask-writing systems with an advanced control system and a column for higher accuracy. |
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Electron Beam Lithograph (FY1999-2001)
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Above 2 themes combined to develop an EB lithography system with enhanced throughput and accuracy. |
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Proximity X-ray Lithography (FY1995-2000)
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Process and system integration on proximity X-ray lithography for 100 nm level design rule devices. |
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Extreme-Ultra-Violet Lithography (FY1998-2001) |
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R&D on multi-layer mask fabrication and resist process technologies,
aspherical mirror optics evaluation and at-wave-length measurement for
masks and optics for EUV lithography. |
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ArF Lithography (FY1995-1997) |
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Development of single layer resist materials, resolution enhancement technology, top surface imaging technology for ArF lithography in 150nm and below technologies. |
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Plasma Physics and Diagnostics (FY1995-2000) |
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Research on plasma source, diagnostics and simulation model for vapor phase and surface reaction. |
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Physical and Chemical Cleaning (FY1995-2000) |
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R&D on supersonic hydro-cleaning by functional water, detection of
fine particles by laser-beam and interface modeling and surface reactions
to analyze cleaning processes by computer models. |
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Ultra Highly Sensitive Magnetic Storage (FY1995-2000) |
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R&D on thin film materials for high density magnetic storage media,
controlled thin film fabrication process and magnetic structure analysis
of nanometer scale storage media. |
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New Functional Elements & Film Fabrication Process (FY1995-2000) |
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R&D on highly sensitive magnetic head fabrication process, Giant Magneto-Resistance
films and spin tunnel junctions. |
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New Functional Electronic Material Technology (FY1995-2000) |
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Research and Development on highly functional electronic material, new functional phenomena and key device technologies for future generation for low power, full-color refrective LCDs. |
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Feasibility Study of LCD Panel Processing Technology (FY1999-2000) |
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Feasibility study on technology for large area LCD panel. |
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Advanced Semiconductor Equipment Technology (FY1999) |
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R&D on high speed and energy efficient plasma processing system, lithography
technology for large diameter wafers. |
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LSI Circuit Simulation Technology (FY2000) |
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Development of high speed and high pin density probe card and high speed, high precision thermal processing. |
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F2 Laser Lithography Technology (FY1999-2004) |
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R&D on F2 laser light source with ultra-narrow spectrum, optical coating,
gas purge and chemical cleaning technology(FY1999-2001 NEDO, FY2002-2004
funded by companies). |
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HALCA Project (FY2001-2003) |
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Development of manufacturing equipment and line system with 60% energy reduction and scalable investment. |
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Advanced Semiconductor Equipment Technology (FY1999) |
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Development of Stencil mask ion implantation technology and 300mm FTP technology (Continued from HALCA project). |
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PFC Substitution Process technology (FY1999-2003) |
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R&D on the technology to reduce or eliminate the use of perfluoro compound
gases (PFC) with large global warming effect for etching and other processes. |
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Electronic System Integration Technology (FY1999-2003) |
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R&D on 3-dimentional packaging technology, optical & electrical
circuit board technology and technology for optimal circuit design. |
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Optical Packaging Standardization Project (FY2004-2005) |
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Development on connectors for optical interconnection between boards and active interposers, and between LSI-chips. |
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MIRAI Project (FY2001-2007) |
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1st & 2nd phase (2001-2005): R&D on high-k gate stack, low-k interconnect,
new transistor structures, lithography-related metrology and new circuit
technologies for 45nm and beyond
3rd phase (2006-2007): Research on new CMOS transistor and ultra-thin EOT high-k gate stack technologies. |
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Wafer & Mask Inspection and Metrology Tools (FY2006-2007) |
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Developments of defect detection technology for pattered wafer and atomic-force microscope for critical dimension measurement(CD-AFM)（Transferred from MIRAI). |
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EUV Absolute-Wave-Front Measurement System (FY2001-2002) |
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R&D on at-wavelength measurement system for the calibration of the
projection optics of EUV exposure tools.(Transferred to EUVA in 2003). |
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EUV Mask and Resists Process Technology (FY2002-2006) |
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R&D on multi-layered masks and resist process technologies for EUV
lithography system. |
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Evaluation of EUV Resist Materials (FY2005-2006) |
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Research on evaluation of resolution, sensitivity and LER for EUV resist materials using small field lithography system HiNA-3. |
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Feasibility Study on Optimization Technology of Mask Design,Drawing, and Inspection for 45nm hp System LSI (FY2005) |
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Feasibility study on the effective optimization technologies on mask design, e-beam writing and inspection for advanced system LSIs in 45nm (half pitch)-and-beyond technologies. |
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Concurrent Optimization Technology of Mask Design,Mask Writing, and Mask Inspection (FY2006-2009) |
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Development of concurrent optimization technologies is performed for cost reduction of photomasks used in lithography. The technologies consist of, (1) optimization of the mask data preparation (MDP), (2) a new mask writing equipment, and (3) a new mask inspection technology. |
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Secure Platform Project (FY2007-2009) |
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Development of next generation IT system platform based on advanced virtual machine technology and integrated access control technology.
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Next Generation Digital Information Appliance Software Pratform Project (FY2008-2010) |
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The development of multimedia software interface and the interface for hardware virtualization, in order to establish next generetion software pratform on digital information appliance.
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